Uncooled InfiRay Micro IIIS 640 55mm Thermal Imaging Module

Uncooled InfiRay Micro IIIS 640 55mm Thermal Imaging Module – Modern Technology in Thermal Imaging

The InfiRay Micro IIIS 640 55mm module is an innovative solution that combines advanced thermal imaging technology with a compact design. With its small size, light weight and exceptional precision, it is an ideal choice for applications in a variety of devices such as drones (UAVs), handheld observation devices and other thermal imaging systems.

Advantages of the InfiRay Micro IIIS 640 55mm Module:

• Compact size and light weight: the module measures just 26×26×22 mm and weighs 20 g, making it extremely easy to integrate into lightweight devices such as drones and small handheld surveillance systems.
• Low power consumption: At full frequency of 50 Hz, the power consumption is < 700 mW, which ensures longer equipment runtime and less heat generated by the system.
• High sensitivity: With a very low sensitivity value of 0.04°C, the module allows detection of subtle temperature differences, which is particularly useful for high-precision applications.
• Wide temperature range: Temperature measurement in the range of -20°C to +550°C makes the module versatile and can be used in various industries such as industry, security, environmental testing, and emergency applications.
• High frame rate: With 50 Hz, the module provides smooth images, even when observing fast-moving objects, which improves the accuracy of detection and the reliability of the information obtained.
• Innovative InfiRay Gen.5 Image Processing Algorithm: The module uses the latest thermal imaging processing algorithm to visualize image details and generate accurate temperature data.
• Compatibility with a variety of platforms: The module supports 5 different data types, making it compatible with a wide range of design platforms, significantly shortening the research and development cycle and reducing system production costs.
• Multifunctionality: the module offers 6 temperature measurement modes, which facilitates the construction and design of thermal imaging devices for various applications. This allows for accurate temperature analysis and temperature point detection.
• RoHS compliance: the module meets environmental requirements, allowing it to be sold in the EU market and other regions where environmental standards are required.
• SDK support: the manufacturer offers a set of SDK software support for developers, enabling easy integration of the module into systems and customization of functions to meet specific user requirements.